The 51th All-Japan Packaging Technique Study Convention sponsored by the Japan Packaging Institute.
The topic of the presentation is the New Evaluation Method for Abrasion Damage of Corrugated Board.
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MAIL : info@hello-idex.co.jp The 51th All-Japan Packaging Technique Study Convention sponsored by the Japan Packaging Institute.
The topic of the presentation is the New Evaluation Method for Abrasion Damage of Corrugated Board.